[PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer driver

[Ivan T. Ivanov]

From: "Ivan T. Ivanov" <iivanov@xxxxxxxxxx>

This series intend to fix driver, which was broken for a while.
It is used to create peripheral role device, which in coordination
with phy-usb-msm driver could provide USB2.0 gadget support for
Qualcomm targets.

Changes since version 2.

 - Rename devicetree description file to ci-hdrc-qcom.txt to be in-line
   with Freescale and Zevio naming scheme
 - Use better name for usb-phy phandle.
 - Make of_device_id structure const

[1] https://lkml.org/lkml/2014/2/18/209

Ivan T. Ivanov (3):
  usb: chipidea: msm: Add device tree binding information
  usb: chipidea: msm: Add device tree support
  usb: chipidea: msm: Initialize offset of the capability registers

 .../devicetree/bindings/usb/ci-hdrc-qcom.txt       | 17 +++++++++++++++
 drivers/usb/chipidea/ci_hdrc_msm.c                 | 24 +++++++++++++++++++++-
 2 files changed, 40 insertions(+), 1 deletion(-)
 create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt

--
1.8.3.2

--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majordomo@xxxxxxxxxxxxxxx
More majordomo info at  http://vger.kernel.org/majordomo-info.html
Please read the FAQ at  http://www.tux.org/lkml/