[PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook
From: Eduardo Valentin
Date: Mon Feb 09 2015 - 19:37:54 EST
This patch adds a book about the Linux Kernel Thermal Framework.
In this change, only a brief introduction is added together with
Signed-off-by: Eduardo Valentin <edubezval@xxxxxxxxx>
Documentation/DocBook/Makefile | 3 +-
Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++
2 files changed, 90 insertions(+), 1 deletion(-)
create mode 100644 Documentation/DocBook/thermal.tmpl
diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile
index 9c7d92d..8163508 100644
@@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \
80211.xml debugobjects.xml sh.xml regulator.xml \
alsa-driver-api.xml writing-an-alsa-driver.xml \
tracepoint.xml drm.xml media_api.xml w1.xml \
- writing_musb_glue_layer.xml crypto-API.xml
+ writing_musb_glue_layer.xml crypto-API.xml thermal.xml
diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl
new file mode 100644
@@ -0,0 +1,88 @@
+<?xml version="1.0" encoding="UTF-8"?>
+<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN"
+ "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" >
+ <title>Linux Kernel Thermal Framework API</title>
+ <holder>Eduardo Valentin</holder>
+ <holder>Sujith Thomas</holder>
+ <holder>Zhang Rui</holder>
+ This documentation is free software; you can redistribute
+ it and/or modify it under the terms of the GNU General Public
+ License version 2 as published by the Free Software Foundation.
+ This program is distributed in the hope that it will be
+ useful, but WITHOUT ANY WARRANTY; without even the implied
+ warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.
+ See the GNU General Public License for more details.
+ For more details see the file COPYING in the source
+ distribution of Linux.
+ <chapter id="introduction">
+ <para>Thermal management is any method or technique implied to
+ mitigate emergencies caused by operating devices within
+ unsupported temperatures. The challenge consists of designing a
+ product keeping the junction temperature of the IC components.
+ The operating temperature of IC components used on products must
+ operate within their design limits. Besides, temperature towards
+ device enclosure must be in a comfort level for the user.
+ Therefore, thermal management, by the time of this writing,
+ starts in very early device design phase. Managing thermal may
+ involve different disciplines, at different stages, such as
+ temperature monitoring, floorplanning, microarchitectural
+ techniques, compiler techniques, OS techniques, liquid cooling,
+ and thermal reliability or security. This document covers what
+ the Linux Kernel Thermal Framework provides as abstraction to
+ users with respect to thermal management.
+ <para>One of the first proposals to provide a solution to cover
+ the thermal problem appears in the Advanced Configuration and
+ Power Interface (ACPI) specification. ACPI provides an open
+ standard for device configuration and power management by the
+ operating system. However, several computing devices which may
+ have thermal issues in the market disregard the ACPI standard.
+ Therefore, the Linux Kernel Thermal Framework has been designed
+ to serve as abstraction for ACPI and non-ACPI systems. The core
+ concepts applies in both types of systems.
+ <para>The Linux Kernel Thermal Framework has a design which
+ represents the different thermal constraints found in an
+ end-products. The thermal constraints exist to serve different
+ purposes. There two major types of thermal constraints. The
+ first is related to components junction temperature. The second
+ is related to the level of comfort while end users are handling
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majordomo@xxxxxxxxxxxxxxx
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/