Re: [PATCH 0/19] v6 multi-die/package topology support

From: Peter Zijlstra
Date: Wed May 15 2019 - 04:57:41 EST

On Mon, May 13, 2019 at 01:58:44PM -0400, Len Brown wrote:
> This patch series does 4 things.
> 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
> 2. Export multi-die topology inside the kernel
> 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
> the difference between die and package-scope MSR.
> 4. Export multi-die topology to user-space via sysfs
> These changes should have no impact on cache topology,
> NUMA topology, Linux scheduler, or system performance.
> These topology changes primarily impact parts of the kernel
> and some applications that care about package MSR scope.
> Also, some software is licensed per package, and other tools,
> such as benchmark reporting software sometimes cares about packages.

I still think having a 'rapl package' be a 'die' is weird, but if that's
the way it is specified in the SDM then so be it.

Acked-by: Peter Zijlstra (Intel) <peterz@xxxxxxxxxxxxx>