Re: [PATCH v3 3/6] dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings

[Rob Herring]

On Mon, 10 Feb 2020 00:04:08 +0530, Sibi Sankar wrote:
> From: David Dai <daidavid1@xxxxxxxxxxxxxx>
> 
> Redefine the Network-on-Chip devices to more accurately describe
> the interconnect topology on Qualcomm's SDM845 platform. Each
> interconnect device can communicate with different instances of the
> RPMh hardware which are described as RSCs(Resource State Coordinators).
> 
> Signed-off-by: David Dai <daidavid1@xxxxxxxxxxxxxx>
> Signed-off-by: Odelu Kukatla <okukatla@xxxxxxxxxxxxxx>
> Signed-off-by: Sibi Sankar <sibis@xxxxxxxxxxxxxx>
> ---
>  .../bindings/interconnect/qcom,sdm845.yaml    | 49 +++++++++++++++----
>  1 file changed, 40 insertions(+), 9 deletions(-)
> 

Reviewed-by: Rob Herring <robh@xxxxxxxxxx>