Re: [PATCH v2 5.10.x] mtd: spinand: Fix incorrect parameters for on-die ECC

From: Greg Kroah-Hartman
Date: Wed Sep 01 2021 - 04:18:09 EST

On Mon, Aug 30, 2021 at 03:02:10PM +0200, Frieder Schrempf wrote:
> From: Frieder Schrempf <frieder.schrempf@xxxxxxxxxx>
> The new generic NAND ECC framework stores the configuration and
> requirements in separate places since commit 93ef92f6f422 ("mtd: nand: Use
> the new generic ECC object"). In 5.10.x The SPI NAND layer still uses only
> the requirements to track the ECC properties. This mismatch leads to
> values of zero being used for ECC strength and step_size in the SPI NAND
> layer wherever nanddev_get_ecc_conf() is used and therefore breaks the SPI
> NAND on-die ECC support in 5.10.x.
> By using nanddev_get_ecc_requirements() instead of nanddev_get_ecc_conf()
> for SPI NAND, we make sure that the correct parameters for the detected
> chip are used. In later versions (5.11.x) this is fixed anyway with the
> implementation of the SPI NAND on-die ECC engine.
> Cc: stable@xxxxxxxxxxxxxxx # 5.10.x
> Reported-by: voice INTER connect GmbH <developer@xxxxxxxxxxxxxxxxxxxx>
> Signed-off-by: Frieder Schrempf <frieder.schrempf@xxxxxxxxxx>
> Acked-by: Miquel Raynal <miquel.raynal@xxxxxxxxxxx>
> ---
> Changes in v2:
> * Fix checkpatch error/warnings for commit message style
> * Add Miquel's A-b tag

Now queued up, thanks.

greg k-h