Re: [PATCH v2 0/3] thermal: More separation between the core and drivers

[Daniel Lezcano]

Hi Rafael,

thank you for this series.

It has been reported a regression with commit cf3986f8c01d3. I'm 
investigating and confirming it. If it is the case a revert may impact 
this series.


On 25/03/2024 14:10, Rafael J. Wysocki wrote:
> Hi Everyone,
>
> This is an update of
>
> https://lore.kernel.org/linux-pm/4558384.LvFx2qVVIh@kreacher/
>
> which is a resend of the series with one extra patch added.  That extra patch
> is related to
>
> https://lore.kernel.org/linux-pm/20240306085428.88011-1-daniel.lezcano@xxxxxxxxxx/
>
> The original description of the first two patches still applies:
>
> > Patch [1/2] is based on the observation that the threshold field in struct
> > thermal_trip really should be core-internal and to make that happen it
> > introduces a wrapper structure around struct thermal_trip for internal
> > use in the core.
> >
> > Patch [2/2] moves the definition of the new structure and the struct
> > thermal_zone_device one to a local header file in the core to enforce
> > more separation between the core and drivers.
> >
> > The patches are not expected to introduce any observable differences in
> > behavior, so please let me know if you see any of that.

--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog