Re: [PATCH v2 0/8] Add RemoteProc cooling support
From: Daniel Lezcano
Date: Fri Mar 06 2026 - 04:20:43 EST
Hi Gaurav,
On Tue, Jan 27, 2026 at 09:27:14PM +0530, Gaurav Kohli wrote:
> This series introduces a generic remote proc cooling framework to control
> thermal sensors located on remote subsystem like modem, dsp etc.
> Communications with these subsystems occurs through various channels, for example,
> QMI interface for Qualcomm.
Can you clarify the semantic of the driver ? It is described as
controlling the thermal sensors, except I'm missing something my
understanding it controls the level of performance of a subsystem
where a thermal sensor is tied to.
> The Framework provides an abstraction layer between thermal subsytem and vendor
> specific remote subsystem. Vendor drivers are expected to implement callback
> and registration mechanisms with cooling framework to control cooling
> devices.
>
> This patchset also revives earlier discussions of QMI based TMD cooling
> devices discussion posted on below series by Casey:
> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@xxxxxxxxxx/
>
> That series introduced Qualcomm QMI-based TMD cooling devices which used
> to mitigate thermal conditions across multiple remote subsystems. These
> devices operate based on junction temperature sensors (TSENS) associated
> with thermal zones for each subsystem and registering with remoteproc
> cooling framework for cooling registration.
> ---
> Changes in v2:
> - Update Remoreproc thermal config to tristate and removed unnecessary NULL checks.
> - Fixed dt binding file format and added generic name support for cdsp.
> - Fixed memory leak and cleaned up qmi-cooling driver file.
> - Corrected DT formatting errors and commit descriptions for all targets.
> - Link to v1: https://lore.kernel.org/linux-devicetree/20251223123227.1317244-1-gaurav.kohli@xxxxxxxxxxxxxxxx/
> ---
>
> Casey Connolly (2):
> remoteproc: qcom: probe all child devices
> thermal: qcom: add qmi-cooling driver
>
> Gaurav Kohli (6):
> thermal: Add Remote Proc cooling driver
> dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
> arm64: dts: qcom: lemans: Enable CDSP cooling
> arm64: dts: qcom: talos: Enable CDSP cooling
> arm64: dts: qcom: kodiak: Enable CDSP cooling
> arm64: dts: qcom: monaco: Enable CDSP cooling
>
> .../bindings/remoteproc/qcom,pas-common.yaml | 6 +
> .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++
> MAINTAINERS | 7 +
> arch/arm64/boot/dts/qcom/kodiak.dtsi | 37 ++
> arch/arm64/boot/dts/qcom/lemans.dtsi | 138 ++++-
> arch/arm64/boot/dts/qcom/monaco.dtsi | 93 ++++
> arch/arm64/boot/dts/qcom/talos.dtsi | 24 +
> drivers/remoteproc/qcom_q6v5.c | 4 +
> drivers/remoteproc/qcom_q6v5_mss.c | 8 -
> drivers/soc/qcom/Kconfig | 13 +
> drivers/soc/qcom/Makefile | 1 +
> drivers/soc/qcom/qmi-cooling.c | 510 ++++++++++++++++++
> drivers/soc/qcom/qmi-cooling.h | 429 +++++++++++++++
> drivers/thermal/Kconfig | 10 +
> drivers/thermal/Makefile | 2 +
> drivers/thermal/remoteproc_cooling.c | 143 +++++
> include/linux/remoteproc_cooling.h | 52 ++
> 17 files changed, 1529 insertions(+), 20 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> create mode 100644 drivers/soc/qcom/qmi-cooling.c
> create mode 100644 drivers/soc/qcom/qmi-cooling.h
> create mode 100644 drivers/thermal/remoteproc_cooling.c
> create mode 100644 include/linux/remoteproc_cooling.h
>
> --
> 2.34.1
>
--