Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Daniel Lezcano]

On Tue, Feb 24, 2026 at 01:17:22PM +0100, Krzysztof Kozlowski wrote:
> On 24/02/2026 13:09, Gaurav Kohli wrote:

[ ... ]

> >>> As a result, each core requires its own cooling device, which must be
> >>> linked to its TSENS thermal zone. Because of this, we introduced
> >>> multiple child nodes—one for each cooling device.
> >>
> >> So you have one device with cooling cells=1+2, no?
> >>
> > 
> > This will be a bigger framework change which is not supported, i can see 
> 
> I don't think that changing open source frameworks is "not supported". I
> am pretty sure that changing is not only supported, but actually desired.

Yes, IMO it could make sense. There are the thermal zones with phandle
to a sensor and a sensor id. We can have the same with a phandle to a
cooling device and a cooling device id.

(... or several ids because the thermal sensor can also have multiple
ids ?)

May be an array of names corresponding to the TMD names at the 'id'
position ?