Re: [PATCH 1/2] dt-bindings: remoteproc: add AMD MicroBlaze binding

From: Michal Simek

Date: Wed Apr 15 2026 - 04:09:50 EST




On 4/15/26 09:07, Krzysztof Kozlowski wrote:
On 15/04/2026 08:55, Michal Simek wrote:

Does it make sense?

Yes, drop from DT. No need for generic stuff. Or describe the hardware.

You need to describe that connection to HW. GPIOs, memory location, etc.
It means there must be any description.

No, you can write user-space driver or pass everything through SW nodes.
No need for DT description.

The firmware memory typically sits behind AXI-to-AXI bridges and
interconnect switches. The bus topology varies between FPGA designs.
DT ranges-based address translation is the standard way to describe
this, and pushing it into userspace would just mean hardcoding what
ranges already provides.

I don't think SW nodes should be used here.


But if you want a DT description, then it must be for the specific
hardware, since the hardware is not generic.

But there is specific HW loaded. It is loaded at power up and don't change over life cycle. What I am just saying that access to this fixed HW (in fpga) is generic. At this stage memory and gpio only.

What I was trying to say is that the hardware topology (memory window +
reset GPIO) is the same regardless of the soft-core cpu (MicroBlaze,
RISC-V, etc.)/fpga, so naming it after the ISA architecture felt wrong to me
too.

When I look at other bindings. For example this one.
Documentation/devicetree/bindings/remoteproc/qcom,glink-rpm-edge.yaml

the compatible describes the communication mechanism (FIFO-based G-Link), not the specific processor behind it.

Our case is similar the compatible describes the control mechanism firmware loaded through a memory window, processor started via GPIO reset. What sits behind that interface varies and is opaque to the binding.

Would something like "amd,mem-gpio-rproc" be acceptable, following the same pattern where the compatible identifies the interface mechanism?

Thanks,
Michal