Re: [PATCH v8 2/9] soc: qcom: Add QMI TMD support for remote thermal mitigation

[Daniel Lezcano]

Le 09/08/2026 à 14:28, Gaurav Kohli a écrit :
> From: Casey Connolly <casey.connolly@xxxxxxxxxx>
>
> Add support for Qualcomm Messaging Interface (QMI) based Thermal Mitigation
> Device (TMD) cooling devices provided by remote subsystems.
>
> On Qualcomm platforms where remote processors expose mitigation controls
> through the TMD QMI service, client drivers need support to discover the
> service, register cooling devices for available mitigation endpoints,
> and forward cooling state updates to remote subsystems.
>
> Signed-off-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
> Co-developed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxxxxxxxx>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxxxxxxxx>
> Co-developed-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
Just to clarify I deeply reviewed this patch and made some changes to 
improve the code. That is the reason why there is a co-dev-b tag but not 
a r-b tag

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