Re: (subset) [PATCH v8 0/9] Add support for Qualcomm remoteproc subsystem cooling

[Bjorn Andersson]

On Sun, 09 Aug 2026 17:58:56 +0530, Gaurav Kohli wrote:
> This series introduces Qualcomm Messaging Interface based Thermal
> Mitigation Device (QMI TMD) support to control thermal mitigation
> on remote subsystems such as the Modem and CDSP.
> 
> The QMI TMD is an interface that instructs a remote subsystem to adjust
> the performance level of the devices it manages, reducing power consumption
> in response to critically low battery charge, overcurrent alerts, or
> overheating conditions.
> 
> [...]

Applied, thanks!

[1/9] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property
      commit: 1a61afc42cff8397cbc430666cf4ce9dec72e076
[2/9] soc: qcom: Add QMI TMD support for remote thermal mitigation
      commit: 2ff581c2185c3797fae2725537c7de1da3bc89fd
[3/9] remoteproc: qcom: pas: add support for TMD thermal cooling devices
      commit: 8eef721027127b7bd8ec06246bf1bbd975dc5f64
[4/9] remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support
      commit: 586a2fadadb160295a93e5d5d32db1a2558a4d3f

Best regards,
-- 
Bjorn Andersson <andersson@xxxxxxxxxx>