[patch 024/108] bonding: fix multiple module load problem

[Greg KH]

2.6.30-stable review patch.  If anyone has any objections, please let us know.

------------------

From: Stephen Hemminger <shemminger@xxxxxxxxxx>

[ Upstream commit 130aa61a77b8518f1ea618e1b7d214d60b405f10 ]

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@xxxxxxxxxx>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@xxxxxxxxxx>
Signed-off-by: Jay Vosburgh <fubar@xxxxxxxxxx>
Signed-off-by: David S. Miller <davem@xxxxxxxxxxxxx>
Signed-off-by: Greg Kroah-Hartman <gregkh@xxxxxxx>

---
 drivers/net/bonding/bond_sysfs.c |    1 +
 1 file changed, 1 insertion(+)

--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1538,6 +1538,7 @@ int bond_create_sysfs(void)
 			printk(KERN_ERR
 			       "network device named %s already exists in sysfs",
 			       class_attr_bonding_masters.attr.name);
+		ret = 0;
 	}
 
 	return ret;


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