Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Stephen Boyd]

On 06/17/14 03:20, Punit Agrawal wrote:
> Ping?
>
> Punit Agrawal <punit.agrawal@xxxxxxx> writes:
>
>> When binding cooling devices to thermal zones created from the device
>> tree the minimum and maximum cooling states are in the wrong order
>> leading to failure to bind.
>>
>> Fix the order of cooling states in the call to
>> thermal_zone_bind_cooling_device to fix this.
>>
>> Cc:Zhang Rui <rui.zhang@xxxxxxxxx>
>> Signed-off-by: Punit Agrawal <punit.agrawal@xxxxxxx>

Ah I ran into the same problem while testing out some thermal DT stuff.

Reviewed-by: Stephen Boyd <sboyd@xxxxxxxxxxxxxx>

-- 
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum,
hosted by The Linux Foundation

--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majordomo@xxxxxxxxxxxxxxx
More majordomo info at  http://vger.kernel.org/majordomo-info.html
Please read the FAQ at  http://www.tux.org/lkml/