Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[edubezval@xxxxxxxxx]

Punit,

On Tue, Jun 3, 2014 at 5:59 AM, Punit Agrawal <punit.agrawal@xxxxxxx> wrote:
> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <rui.zhang@xxxxxxxxx>

Acked-by: Eduardo Valentin <edubezval@xxxxxxxxx>

Rui, to avoid further delays, can you please pick this one directly?

> Signed-off-by: Punit Agrawal <punit.agrawal@xxxxxxx>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
>  drivers/thermal/of-thermal.c |    4 ++--
>  1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>
>                         ret = thermal_zone_bind_cooling_device(thermal,
>                                                 tbp->trip_id, cdev,
> -                                               tbp->min,
> -                                               tbp->max);
> +                                               tbp->max,
> +                                               tbp->min);
>                         if (ret)
>                                 return ret;
>                 }
> --
> 1.7.10.4
>



-- 
Eduardo Bezerra Valentin
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