Re: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook

[Randy Dunlap]

On 02/09/15 13:34, Eduardo Valentin wrote:

> +	<chapter id="introduction">
> +		<title>Introduction</title>
> +		<para>Thermal management is any method or technique implied to
> +		mitigate emergencies caused by operating devices within
> +		unsupported temperatures. The challenge consists of designing a

I would flip the ending of that sentence:
		                     caused by operating devices outside of
		supported temperatures.

> +		product keeping the junction temperature of the IC components.
> +		The operating temperature of IC components used on products must
> +		operate within their design limits. Besides, temperature towards
> +		device enclosure must be in a comfort level for the user.
> +		Therefore, thermal management, by the time of this writing,
> +		starts in very early device design phase. Managing thermal may
> +		involve different disciplines, at different stages, such as
> +		temperature monitoring, floorplanning, microarchitectural
> +		techniques, compiler techniques, OS techniques, liquid cooling,
> +		and thermal reliability or security. This document covers what
> +		the Linux Kernel Thermal Framework provides as abstraction to
> +		users with respect to thermal management.  
> +		</para>
> +		<para>One of the first proposals to provide a solution to cover
> +		the thermal problem appears in the Advanced Configuration and
> +		Power Interface (ACPI) specification. ACPI provides an open
> +		standard for device configuration and power management by the
> +		operating system. However, several computing devices which may
> +		have thermal issues in the market disregard the ACPI standard.
> +		Therefore, the Linux Kernel Thermal Framework has been designed
> +		to serve as abstraction for ACPI and non-ACPI systems. The core
> +		concepts applies in both types of systems. 
> +		</para>
> +		<para>The Linux Kernel Thermal Framework has a design which
> +		represents the different thermal constraints found in an

drop:		                                                      an^^

> +		end-products. The thermal constraints exist to serve different
> +		purposes. There two major types of thermal constraints. The

		          There are two

> +		first is related to components junction temperature. The second
> +		is related to the level of comfort while end users are handling
> +		devices.
> +		</para>
> +
> +  </chapter>
> +</book>
> 


-- 
~Randy
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