Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

[Wangtao (Kevin, Kirin)]

å 2017/9/1 2:24, Daniel Lezcano åé:
> On 29/08/2017 10:17, Tao Wang wrote:
> > From: Tao Wang <kevin.wangtao@xxxxxxxxxx>
> >
> > This adds documentation of device tree bindings for the
> > thermal sensor controller of hi3660 SoC.
> >
> > Signed-off-by: Tao Wang <kevin.wangtao@xxxxxxxxxx>
> > ---
> >   .../devicetree/bindings/thermal/hisi-tsensor.txt   | 37 ++++++++++++++++++++++
> >   1 file changed, 37 insertions(+)
> >   create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> >
> > diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> > new file mode 100644
> > index 0000000..4643dbe
> > --- /dev/null
> > +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> > @@ -0,0 +1,37 @@
> > +* Temperature Sensor on hisilicon SoC
> > +
> > +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D
> > +area contains a temperture sensor. The temperture sensor produces an output
> > +value which has a linear relationship with the temperture of the area.
> > +
>
> s/temperture/temperature/
THX
> > +for Hi3660,
> > +sensor0 monitors the temperture of A53;
> > +sensor1 monitors the temperture of A72;
> > +sensor2 monitors the temperture of GPU;
> > +sensor3 is a virtual sensor, which produces the maximum value of all sensors;
> > +sensor4 is a virtual sensor, which produces the average value of all sensors.
>
> I don't think we need to escribe the virtual sensors in the DT bindings.
I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough?
> > +** Required properties :
> > +- compatible: "hisilicon,thermal-tsensor".
> > +- reg: physical reg address of thermal sensor and length of memory mapped
> > +  region.
> > +- hisi,tsensors: number of hardware tsensors
> > +- hisi,coef:	An array of integers (one signed cell) containing
> > +		coefficients to turn adc value to temperture.
> > +- hisi,adc-range: adc value range, minimum value is followed by maximum value.
> > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> > +
> > +Example :
> > +Hi3660:
> > +tsensor: tsensor@fff30000 {
> > +	compatible = "hisilicon,hi3660-tsensor";
> > +	#address-cells = <2>;
> > +	#size-cells = <2>;
> > +	reg = <0x0 0xfff3001c 0x0 0x4>,
> > +		<0x0 0xfff3005c 0x0 0x4>,
> > +		<0x0 0xfff3009c 0x0 0x4>;
> > +	hisi,tsensors = <HISI_MAX_TSENSORS>;
> > +	hisi,coef = <165000 (-40000)>;
> > +	hisi,adc-range = <0x74 0x39A>;
>
> Do we really need max sensors, coef and adc range to be specified in the DT?
>
> Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
> coef, adc, in the driver itself?
My purpose is to make the driver be compitable with our future platform.
> Can't this binding be merged with the hisilicon-thermal.txt?
>
> Thanks.
>
>    -- Daniel