Re: [GIT PULL V3] Thermal SoC management updates for v4.17-rc1

[Zhang Rui]

On ä, 2018-04-18 at 07:10 -0700, Eduardo Valentin wrote:
> Hello,
> 
> On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> > 
> > Hi, Eduardo,
> > 
> > On å, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > > 
> > > Hello Linus,
> > > 
> > > Please find thermal-soc changes for v4.17-rc1.
> > > Rui asked me to send the pull request directly to you
> > > as we are close to the end of the merge window.
> > > Essentially this pull removes the series that caused
> > > warning regression. I will work with the developer
> > > to get that fixed later on, but I am still sending
> > > the other few patches that are unrelated to that.
> > > Let me know if this causes any issues and can still
> > > be pulled.
> > > 
> > > Changelog:
> > > - New i.MX7 thermal sensor
> > > - Mediatek driver now supports MT7622 SoC
> > > - Removal of min max cpu cooling DT property
> > > 
> > > Differences in V3:
> > > - Rebased on top current linus/master, to avoid and merge issues
> > > from previous pulled thermal code.
> > > 
> > > Differences in V2:
> > > - Reordered the patches to drop exynos changes for now until we
> > > get
> > > agreement on the fix on that driver for the compilation warns
> > > caused by the confusing conversion functions.
> > > 
> > > 
> > > The following changes since commit
> > > 48023102b7078a6674516b1fe0d639669336049d:
> > > 
> > > Â Merge branch 'overlayfs-linus' of
> > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-
> > > 04-
> > > 13 16:55:41 -0700)
> > > 
> > > are available in the git repository at:
> > > 
> > > Â git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-
> > > soc-
> > > thermal linus
> > > 
> > > for you to fetch changes up to
> > > 15a32df1918259be6c23fc36014fc26ee66c836c:
> > > 
> > > Â dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > properties
> > > (2018-04-14 09:37:55 -0700)
> > > 
> > This pull request does not catch this merge window.
> > So do you want to split it into 2 separate pull requests, one for
> > 4.17-
> > rc and another for 4.18-rc1?
> OK. Yeah, I am fine with that.
> 
> > 
> > 
> > > 
> > > ----------------------------------------------------------------
> > > Anson Huang (1):
> > > ÂÂÂÂÂÂthermal: imx: add i.MX7 thermal sensor support
> > > 
> > > Bartlomiej Zolnierkiewicz (1):
> > > ÂÂÂÂÂÂdt-bindings: thermal: remove no longer needed samsung
> > > thermal
> > > properties
> > > 
> > > Sean Wang (2):
> > > ÂÂÂÂÂÂdt-bindings: thermal: add binding for MT7622 SoC
> > > ÂÂÂÂÂÂthermal: mediatek: add support for MT7622 SoC
> > > 
> > > Viresh Kumar (1):
> > > ÂÂÂÂÂÂdt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > properties
> > > 
> > IMO, together with the refreshed exynos fixes, the one from Viresh
> > and
> > the one fromÂBartlomiej can be queued for 4.17-rc, and the others
> > have
> > to wait until next merge window.
> > 
> Correct, the new chip support will need to wait for the next merge
> window. I have already split the patches into the two categories.
> The patches removing stuff are in my -fixes branch. All the other
> adding
> new chip support are in my -linus branch.
> 
> Now, Do you have anything for this -rc2 ? If not, I will send
> directly
> to Linus the stuff in my -fixes branch. Let me know.
> 
No, I don't have anything for -rc2. so please send pull request to
Linux directly.

thanks,
rui