Re: [GIT PULL] Qualcomm ARM64 DT updates for 4.20

[Arnd Bergmann]

On Sun, Sep 30, 2018 at 8:38 PM Andy Gross <andy.gross@xxxxxxxxxx> wrote:
>
> The following changes since commit 5b394b2ddf0347bef56e50c69a58773c94343ff3:
>
>   Linux 4.19-rc1 (2018-08-26 14:11:59 -0700)
>
> are available in the git repository at:
>
>   git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux.git tags/qcom-arm64-for-4.20
>
> for you to fetch changes up to 6db0483cf622fc690e32e0804f8b86061f13962a:
>
>   Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" (2018-09-30 12:59:52 -0500)
>
> ----------------------------------------------------------------
> Qualcomm ARM64 Updates for v4.20
>
> * Update Coresight for MSM8916
> * Switch to use mailbox for smp2p and smd on MSM8996
> * Add dispcc, dsp, USB, regulator, and other nodes for SDM845
> * Drop model/compatible from MSM8916 and MSM8996
> * Add compat for db820c
> * Add MSM8998 SoC and board support along with associated nodes
> * Add RESIN/PON for Qualcomm PM8916 and PM8994

Pulled into next/dt, thanks.

There is a small chance that the two reverts end up causing more
problems than they help: they might conflict with the patches merged
into the iio branch, or they could end up being applied on top of
the iio branch and revert the changes during the release. I think
it will be fine, but it's obviously better to avoid this.

      Arnd