[PATCH 0/18] v4 multi-die/package topology support

From: Len Brown
Date: Wed May 01 2019 - 00:24:46 EST

This patch series does 4 things.

1. Parse the new CPUID.1F leaf to discover multi-die/package topology

2. Export multi-die topology inside the kernel

3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
the difference between die and package-scope MSR.

4. Export multi-die topology to user-space via sysfs

These changes should have 0 impact on cache topology,
NUMA topology, Linux scheduler, or system performance.

These topology changes primarily impact parts of the kernel
and some applications that care about package MSR scope.
Also, some software is licensed per package, and other tools,
such as benchmark reporting software sometimes cares about packages.

Updates since v3:


Earlier today I sent the correct v3 e-mail header, pointing to the
correct git branch, but ran git-send-email from the wrong directory
and it happily spammed you with a copy of the old 14-patch v1 series.
Sorry about that!

Updates since v2:

All review feedback has been addressed.

In response to brice, peterz and Morten Rasmussen,
used the word "cpu" rather than "thread" for the new sysfs attributes.

In response to tglx, replaced access to cpuinfo_x86.x86_max_dies,
with macro topology_max_die_per_package(). In doing so,
deleted this new per-cpu field entirely, as a global is sufficient.

Also, appended 3 patches from Kan Liang, updating the perf code
to be multi-die aware. These patches are similar to the preceding
power and temperature patches. I believe that with these patches,
this series now includes all needed multi-die kernel support.

The following changes since commit 085b7755808aa11f78ab9377257e1dad2e6fa4bb:

Linux 5.1-rc6 (2019-04-21 10:45:57 -0700)

are available in the Git repository at:

git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux.git x86

for you to fetch changes up to 6c4891c7f2f1eacfcab00bf5d84b5ac119f654b9:

perf/x86/intel/cstate: Support multi-die/package (2019-04-30 16:49:26 -0400)

Kan Liang (3):
perf/x86/intel/uncore: Support multi-die/package
perf/x86/intel/rapl: Support multi-die/package
perf/x86/intel/cstate: Support multi-die/package

Len Brown (10):
x86 topology: Fix doc typo
topology: Simplify cputopology.txt formatting and wording
x86 smpboot: Rename match_die() to match_pkg()
x86 topology: Add CPUID.1F multi-die/package support
x86 topology: Create topology_max_die_per_package()
cpu topology: Export die_id
x86 topology: Define topology_die_id()
x86 topology: Define topology_logical_die_id()
topology: Create package_cpus sysfs attribute
topology: Create core_cpus and die_cpus sysfs attributes

Zhang Rui (5):
powercap/intel_rapl: Simplify rapl_find_package()
powercap/intel_rapl: Support multi-die/package
thermal/x86_pkg_temp_thermal: Support multi-die/package
powercap/intel_rapl: update rapl domain name and debug messages
hwmon/coretemp: Support multi-die/package

Documentation/cputopology.txt | 80 +++++++++++++++----------
Documentation/x86/topology.txt | 6 +-
arch/x86/events/intel/cstate.c | 14 +++--
arch/x86/events/intel/rapl.c | 10 ++--
arch/x86/events/intel/uncore.c | 20 ++++---
arch/x86/include/asm/processor.h | 4 +-
arch/x86/include/asm/smp.h | 1 +
arch/x86/include/asm/topology.h | 17 ++++++
arch/x86/kernel/cpu/common.c | 1 +
arch/x86/kernel/cpu/topology.c | 88 ++++++++++++++++++++++------
arch/x86/kernel/smpboot.c | 75 +++++++++++++++++++++++-
arch/x86/xen/smp_pv.c | 1 +
drivers/base/topology.c | 22 +++++++
drivers/hwmon/coretemp.c | 9 +--
drivers/powercap/intel_rapl.c | 75 +++++++++++++-----------
drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 +--
include/linux/topology.h | 6 ++
17 files changed, 322 insertions(+), 115 deletions(-)