Re: [PATCH 0/19] v6 multi-die/package topology support

[Ingo Molnar]

* Len Brown <lenb@xxxxxxxxxx> wrote:

> 
> This patch series does 4 things.
> 
> 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
> 
> 2. Export multi-die topology inside the kernel
> 
> 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
>    the difference between die and package-scope MSR.
> 
> 4. Export multi-die topology to user-space via sysfs
> 
> These changes should have no impact on cache topology,
> NUMA topology, Linux scheduler, or system performance.

Thank you Len:

Reviewed-by: Ingo Molnar <mingo@xxxxxxxxxx>

	Ingo