[tip:x86/topology] thermal/x86_pkg_temp_thermal: Support multi-die/package
From: tip-bot for Zhang Rui
Date: Thu May 23 2019 - 05:30:39 EST
Commit-ID: 724adec33c2491f26f739f285ddca25fca226e48
Gitweb: https://git.kernel.org/tip/724adec33c2491f26f739f285ddca25fca226e48
Author: Zhang Rui <rui.zhang@xxxxxxxxx>
AuthorDate: Mon, 13 May 2019 13:58:52 -0400
Committer: Thomas Gleixner <tglx@xxxxxxxxxxxxx>
CommitDate: Thu, 23 May 2019 10:08:33 +0200
thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@xxxxxxxxx>
Signed-off-by: Len Brown <len.brown@xxxxxxxxx>
Signed-off-by: Thomas Gleixner <tglx@xxxxxxxxxxxxx>
Reviewed-by: Ingo Molnar <mingo@xxxxxxxxxx>
Acked-by: Peter Zijlstra (Intel) <peterz@xxxxxxxxxxxxx>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@xxxxxxxxx
---
drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
1 file changed, 4 insertions(+), 4 deletions(-)
diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ err_out:
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
static int pkg_temp_thermal_device_add(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
- packages[topology_logical_package_id(cpu)] = NULL;
+ packages[topology_logical_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;
- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * topology_max_die_per_package();
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)