Re: [PATCH v3 0/3] thermal: introduce by-name softlink

[Daniel Lezcano]

On 05/12/2019 08:19, Wei Wang wrote:
> The paths thermal_zone%d and cooling_device%d are not intuitive and the
> numbers are subject to change due to device tree change. This usually
> leads to tree traversal in userspace code.
> The patch creates `tz-by-name' and `cdev-by-name' for thermal zone and
> cooling_device respectively.

Instead of adding another ABI, I suggest we put the current one
deprecated with a warning in the dmesg, update the documentation and
change the name the next version.


> Changes since v1 [1]:
>  * Split cooling device registration into a seperate patch
> Changes since v2 [2]:
>  * Split improve error message in thermal zone registration
> 
> [1]: v1: https://lore.kernel.org/patchwork/patch/1139450/
> [2]: v2: https://lkml.org/lkml/2019/12/4/1291
> 
> Wei Wang (3):
>   thermal: prevent cooling device with no type to be registered
>   thermal: improve error message in thermal zone registration
>   thermal: create softlink by name for thermal_zone and cooling_device
> 
>  drivers/thermal/thermal_core.c | 55 +++++++++++++++++++++++++++-------
>  1 file changed, 44 insertions(+), 11 deletions(-)
> 


-- 
 <http://www.linaro.org/> Linaro.org â Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog