[PATCH 0/3] Thermal extensions for flexibility in cooling device bindings

[lukasz . luba]

From: Lukasz Luba <lukasz.luba@xxxxxxx>

Hi all,

This patch set adds extensions to existing thermal zones and cooling devices
binding. Currently they are pinned using static definitions e.g. DT cooling
maps. These changes enable userspace like trusted middleware to change the
layout of cooling maps unbinding and binding the cooling devices.
It might be helpful for drivers loaded as a modules. They can be added to
existing thermal zones to take part of the power split.
It is based on the current work in thermal branch thermal/linux-next
https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next

Regards,
Lukasz Luba

Lukasz Luba (3):
  docs: thermal: Add bind, unbind information together with trip point
  thermal: Make cooling device trip point writable from sysfs
  thermal: Add sysfs binding for cooling device and thermal zone

 .../driver-api/thermal/sysfs-api.rst          | 30 +++++++-
 drivers/thermal/thermal_core.c                |  3 +-
 drivers/thermal/thermal_core.h                |  2 +
 drivers/thermal/thermal_sysfs.c               | 77 +++++++++++++++++++
 4 files changed, 109 insertions(+), 3 deletions(-)

-- 
2.17.1