Re: [PATCH v6 0/4] thermal: k3: Add support for bandgap sensors

[Tero Kristo]

On 09/04/2020 17:07, J, KEERTHY wrote:
> On 4/9/2020 7:19 PM, Daniel Lezcano wrote:
> > Hi Keerthy,
> >
> > On 07/04/2020 07:51, Keerthy wrote:
> > > Add VTM thermal support. In the Voltage Thermal
> > > Management Module(VTM), K3 AM654 supplies a voltage
> > > reference and a temperature sensor feature that are gathered in the band
> > > gap voltage and temperature sensor (VBGAPTS) module. The band
> > > gap provides current and voltage reference for its internal
> > > circuits and other analog IP blocks. The analog-to-digital
> > > converter (ADC) produces an output value that is proportional
> > > to the silicon temperature.
> > >
> > > Add support for bandgap sensors. Currently reading temperatures
> > > is supported.
> >
> > How do you want to proceed? Shall I take patches 1 & 2 ?
>
> +Tero
>
> Hi Tero,
>
> Can you pull 3 & 4? Or Daniel can take all 4?

Let me pull the DT patches, that way we avoid any conflicts in the 
arm64/dts tree. There has been quite a bit of traffic on that front 
lately and we did mess up something with the current merge window already.

I believe you are picking the driver side changes to 5.8?

-Tero

> - Keerthy
>
> > > Changes in v6:
> > >
> > > ÂÂ * Removed bunch of unused #defines and couple of redundant variables.
> > > ÂÂ * Reordered patches a bit.
> > > ÂÂ * Minor reordering in dt binding patch.
> > >
> > > Changes in v5:
> > >
> > > ÂÂ * Removed thermal work function which was unused.
> > > ÂÂ * Removed unused preve_tenmp and a couple more struct variables.
> > > ÂÂ * Removed couple of redundant header function include.
> > >
> > > Changes in v4:
> > >
> > > ÂÂ * Fixed comments from Daniel to remove trend function.
> > > ÂÂ * Mostly cleaned up all the unused variables.
> > > ÂÂ * Driver from bool to tristate.
> > >
> > > Changes in v3:
> > >
> > > ÂÂ * Fixed errors seen with:
> > > ÂÂÂÂ dt_binding_check 
> > > DT_SCHEMA_FILES=Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml 
> > >
> > >
> > > Changes in v2:
> > >
> > > ÂÂ * Fixed yaml errors
> > > ÂÂ * renamed am654-industrial-thermal.dtsi to 
> > > k3-am654-industrial-thermal.dtsi
> > > ÂÂÂÂ to follow the convention for k3 family.
> > >
> > > Keerthy (4):
> > > ÂÂ dt-bindings: thermal: k3: Add VTM bindings documentation
> > > ÂÂ thermal: k3: Add support for bandgap sensors
> > > ÂÂ arm64: dts: ti: am65-wakeup: Add VTM node
> > > ÂÂ arm64: dts: ti: am654: Add thermal zones
> > >
> > > Â .../bindings/thermal/ti,am654-thermal.yamlÂÂÂ |Â 56 ++++
> > > Â arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsiÂÂÂ |Â 11 +
> > > Â .../dts/ti/k3-am654-industrial-thermal.dtsiÂÂ |Â 45 +++
> > > Â drivers/thermal/KconfigÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂ |Â 10 +
> > > Â drivers/thermal/MakefileÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂ |ÂÂ 1 +
> > > Â drivers/thermal/k3_bandgap.cÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂÂ | 264 ++++++++++++++++++
> > > Â 6 files changed, 387 insertions(+)
> > > Â create mode 100644 
> > > Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> > > Â create mode 100644 
> > > arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
> > > Â create mode 100644 drivers/thermal/k3_bandgap.c

--
Texas Instruments Finland Oy, Porkkalankatu 22, 00180 Helsinki. Y-tunnus/Business ID: 0615521-4. Kotipaikka/Domicile: Helsinki