Re: [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw

[Lad, Prabhakar]

Hi Tudor,

On Mon, Dec 7, 2020 at 5:27 PM <Tudor.Ambarus@xxxxxxxxxxxxx> wrote:
>
> Hi, Lad,
>
> On 10/16/20 2:55 PM, Lad Prabhakar wrote:
> > EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe
> >
> > This chip is (nearly) identical to the Winbond w25m512jv which is
> > already supported by Linux. Compared to the w25m512jv, the 'jw'
> > has a different JEDEC ID.
>
> W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory,
> introduces a new “Software Die Select (C2h)” instruction, which we don't
> support. I guess you can't access the second die with what we have in
> mainline. Or am I wrong? We'll need to add support for multi-die support
> if we want to add new multi-die flashes.
>
My bad, yes only the first die is accessible.  I'll post a patch
dropping this id.

Cheers,
Prabhakar