[git pull] Thermal material for v5.13-rc
From: Daniel Lezcano
Date: Wed May 05 2021 - 04:44:41 EST
Hi Linus,
please consider these thermal changes for v5.13-rc1
Thanks
-- Daniel
The following changes since commit a38fd8748464831584a19438cbb3082b5a2dab15:
Linux 5.12-rc2 (2021-03-05 17:33:41 -0800)
are available in the Git repository at:
ssh://git@xxxxxxxxxxxxxxxxxxx/pub/scm/linux/kernel/git/thermal/linux.git
tags/thermal-v5.13-rc1
for you to fetch changes up to c310e546164d5cca4c12faf9582b75989b030b68:
thermal/drivers/mtk_thermal: Remove redundant initializations of
several variables (2021-04-22 23:51:32 +0200)
----------------------------------------------------------------
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas
Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of
a couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał
Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well
as the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of
cleanups and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
----------------------------------------------------------------
Ansuel Smith (9):
thermal/drivers/tsens: Don't hardcode sensor slope
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Add support for ipq8064-tsens
dt-bindings: thermal: tsens: Document ipq8064 bindings
Bhaskar Chowdhury (2):
thermal: Fix a typo in the file soctherm.c
thermal: Fix couple of spellos in the file sun8i_thermal.c
Colin Ian King (2):
thermal: Fix spelling mistake "disabed" -> "disabled"
thermal/drivers/mtk_thermal: Remove redundant initializations of
several variables
Daniel Lezcano (8):
thermal/drivers/core: Use a char pointer for the cooling device name
thermal/drivers/cpufreq_cooling: Use device name instead of
auto-numbering
thermal/drivers/devfreq_cooling: Use device name instead of
auto-numbering
thermal/drivers/cpuidle_cooling: Use device name instead of
auto-numbering
thermal/drivers/cpufreq_cooling: Remove unused list
thermal/core: Fix memory leak in the error path
thermal/drivers/devfreq_cooling: Fix wrong return on error path
thermal/drivers/cpuidle_cooling: Fix use after error
David Collins (1):
thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1
PMIC peripherals
Guangqing Zhu (1):
thermal/drivers/tsens: Fix missing put_device error
Hao Fang (1):
thermal/drivers/hisi: Use the correct HiSilicon copyright
Jia-Ju Bai (1):
thermal: thermal_of: Fix error return code of
thermal_of_populate_bind_params()
Konrad Dybcio (3):
thermal/drivers/qcom/tsens_v1: Enable sensor 3 on MSM8976
dt-bindings: tsens: qcom: Document MDM9607 compatible
thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607
Lin Ruizhe (1):
thermal/drivers/ti-soc-thermal/bandgap Remove unused variable 'val'
Lukasz Luba (7):
MAINTAINERS: update thermal CPU cooling section
thermal/core: Create a helper __thermal_cdev_update() without a lock
thermal/core/power_allocator: Maintain the device statistics from
going stale
thermal/core/power_allocator: Update once cooling devices when
temp is low
thermal/core/fair share: Lock the thermal zone while looping over
instances
thermal/core/fair share: Use the lockless __thermal_cdev_update()
function
thermal/core/power allocator: Use the lockless
__thermal_cdev_update() function
Niklas Söderlund (2):
thermal: rcar_gen3_thermal: Add support for up to five TSC nodes
dt-bindings: thermal: rcar-gen3-thermal: Support five TSC nodes on
r8a779a0
Rafał Miłecki (2):
dt-bindings: thermal: thermal-sensor: require "#thermal-sensor-cells"
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
Robert Foss (1):
dt-bindings: thermal: qcom-tsens: Add compatible for sm8350
Ruiqi Gong (2):
thermal/drivers/thermal_mmio: Remove redundant dev_err call in
thermal_mmio_probe()
thermal/drivers/bcm2835: Remove redundant dev_err call in
bcm2835_thermal_probe()
Tang Bin (1):
thermal: amlogic: Omit superfluous error message in
amlogic_thermal_probe()
Thara Gopinath (4):
MAINTAINERS: Add co-maintainer for Qualcomm tsens thermal drivers
iwlwifi: mvm: tt: Replace thermal_notify_framework
thermal/core: Remove thermal_notify_framework
Documentation: driver-api: thermal: Remove
thermal_notify_framework from documentation
Ye Bin (1):
thermal/drivers/hisi: Remove redundant dev_err call in
hisi_thermal_probe()
Zhang Rui (1):
thermal/drivers/intel: Introduce tcc cooling driver
Zhang Yunkai (1):
thermal:ti-soc-thermal: Remove duplicate include in ti-bandgap
Zhen Lei (1):
thermal/drivers/ti-soc-thermal/ti-bandgap: Rearrange all the
included header files alphabetically
brian-sy yang (1):
thermal/drivers/cpufreq_cooling: Fix slab OOB issue
dingsenjie (1):
thermal/drivers/tegra: Use devm_platform_ioremap_resource_byname
jeson.gao (1):
thermal/core/power_allocator: Using round the division when
re-divvying up power
.../bindings/thermal/brcm,ns-thermal.txt | 37 ----
.../bindings/thermal/brcm,ns-thermal.yaml | 60 ++++++
.../devicetree/bindings/thermal/qcom-tsens.yaml | 59 +++++-
.../bindings/thermal/rcar-gen3-thermal.yaml | 43 +++-
.../bindings/thermal/thermal-sensor.yaml | 3 +
Documentation/driver-api/thermal/sysfs-api.rst | 12 +-
MAINTAINERS | 3 +-
drivers/net/ethernet/mellanox/mlxsw/core_thermal.c | 2 +-
drivers/net/wireless/intel/iwlwifi/mvm/tt.c | 4 +-
drivers/thermal/amlogic_thermal.c | 4 +-
drivers/thermal/broadcom/bcm2835_thermal.c | 1 -
drivers/thermal/cpufreq_cooling.c | 49 ++---
drivers/thermal/cpuidle_cooling.c | 37 ++--
drivers/thermal/devfreq_cooling.c | 25 +--
drivers/thermal/gov_fair_share.c | 11 +-
drivers/thermal/gov_power_allocator.c | 32 ++-
drivers/thermal/hisi_thermal.c | 10 +-
drivers/thermal/intel/Kconfig | 11 +
drivers/thermal/intel/Makefile | 1 +
drivers/thermal/intel/intel_tcc_cooling.c | 129 +++++++++++
drivers/thermal/mtk_thermal.c | 12 +-
drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 91 +++++---
drivers/thermal/qcom/tsens-8960.c | 235
++++++++++-----------
drivers/thermal/qcom/tsens-v0_1.c | 98 ++++++++-
drivers/thermal/qcom/tsens-v1.c | 4 +-
drivers/thermal/qcom/tsens.c | 165 ++++++++++++---
drivers/thermal/qcom/tsens.h | 6 +-
drivers/thermal/rcar_gen3_thermal.c | 3 +-
drivers/thermal/sun8i_thermal.c | 4 +-
drivers/thermal/tegra/soctherm.c | 15 +-
drivers/thermal/thermal_core.c | 57 ++---
drivers/thermal/thermal_core.h | 1 +
drivers/thermal/thermal_helpers.c | 27 ++-
drivers/thermal/thermal_mmio.c | 5 +-
drivers/thermal/thermal_of.c | 7 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 37 ++--
include/linux/thermal.h | 7 +-
include/uapi/linux/thermal.h | 2 +-
38 files changed, 863 insertions(+), 446 deletions(-)
delete mode 100644
Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt
create mode 100644
Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml
create mode 100644 drivers/thermal/intel/intel_tcc_cooling.c
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