[PATCH -next] thermal: thermal_of: Correct struct name __thermal_bind_params
From: Yang Yingliang
Date: Tue May 18 2021 - 09:12:00 EST
Fix the following make W=1 kernel build warning:
drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead
Signed-off-by: Yang Yingliang <yangyingliang@xxxxxxxxxx>
---
drivers/thermal/thermal_of.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c
index 5b76f9a1280d..e86389fa1431 100644
--- a/drivers/thermal/thermal_of.c
+++ b/drivers/thermal/thermal_of.c
@@ -35,7 +35,7 @@ struct __thermal_cooling_bind_param {
};
/**
- * struct __thermal_bind_param - a match between trip and cooling device
+ * struct __thermal_bind_params - a match between trip and cooling device
* @tcbp: a pointer to an array of cooling devices
* @count: number of elements in array
* @trip_id: the trip point index
--
2.25.1