Re: [PATCH v3 00/32] New thermal OF code

[Daniel Lezcano]

Hi Rafael,

On 28/07/2022 16:37, Rafael J. Wysocki wrote:
> Hi Daniel,
>
> On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano
> <daniel.lezcano@xxxxxxxxxx> wrote:
> > Hi Rafael,
> >
> > we are close to release v5.19.
> >
> > I want to send a PR this week but it would be nice if this series could
> > be part of it, so the trip point rework we discussed earlier (it is a
> > long series) could be merged more easily for v5.21-rc1 as it will depend
> > on these changes.
> >
> > This series was tested on different platforms, rk3399, broadcom and
> > rcar. The external drivers as ata, touchscreen, regulator, hwmon were
> > acked/reviewed and some other thermal drivers reviewed also. Some others
> > remain without feedback because the maintainer is unresponsive or the
> > driver is orphaned, falling under the thermal framework maintenance
> > umbrella. All the drivers changes are the same.
> >
> > I do believe it does a nice cleanup and consolidation of the OF thermal
> > code and realign it with the core thermal framework.
> >
> > Is it ok to merge the series?
>
> I would prefer to put it into linux-next for a few days.
>
> Why don't you send 2 pull requests, one with all of the other material
> you have for 5.20 and another one with this series (it may be on top
> of the first one)?
>
> I will be able to defer pushing the second one till the second half of
> the merge window.

I setup a branch with the patches and the fixes.

https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/v6.0-rc1-2

Is there still time for a PR ?