Re: [PATCH 2/4] thermal: qcom: Add Kconfig entry & compilation support for qmi cooling driver

From: Bjorn Andersson
Date: Tue Sep 13 2022 - 14:59:55 EST


On Mon, Sep 12, 2022 at 02:20:47PM +0530, Bhupesh Sharma wrote:
> Add Kconfig entry & compilation support for Qualcomm qmi cooling driver.
>

There's no reason for introducing this in a separate patch...

> Cc: daniel.lezcano@xxxxxxxxxx
> Cc: rafael@xxxxxxxxxx
> Cc: andersson@xxxxxxxxxx
> Signed-off-by: Bhupesh Sharma <bhupesh.sharma@xxxxxxxxxx>
> ---
> drivers/thermal/qcom/Kconfig | 4 ++++
> drivers/thermal/qcom/Makefile | 2 ++
> drivers/thermal/qcom/qmi_cooling/Kconfig | 14 ++++++++++++++
> drivers/thermal/qcom/qmi_cooling/Makefile | 3 +++
> 4 files changed, 23 insertions(+)
> create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig
> create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile
>
> diff --git a/drivers/thermal/qcom/Kconfig b/drivers/thermal/qcom/Kconfig
> index ccfd090273c1..d383b2cf4c7f 100644
> --- a/drivers/thermal/qcom/Kconfig
> +++ b/drivers/thermal/qcom/Kconfig
> @@ -53,3 +53,7 @@ config QCOM_LMH
> input from temperature and current sensors. On many newer Qualcomm SoCs
> LMh is configured in the firmware and this feature need not be enabled.
> However, on certain SoCs like sdm845 LMh has to be configured from kernel.
> +
> +menu "Qualcomm QMI cooling drivers"
> +source "drivers/thermal/qcom/qmi_cooling/Kconfig"

...except for the fact that I missed that you put the new driver in a
new directory, with new Kconfig menu etc.

Please just name your files appropriately and put them in
drivers/thermal/qcom directly.

Regards,
Bjorn

> +endmenu
> diff --git a/drivers/thermal/qcom/Makefile b/drivers/thermal/qcom/Makefile
> index 0fa2512042e7..61114129827a 100644
> --- a/drivers/thermal/qcom/Makefile
> +++ b/drivers/thermal/qcom/Makefile
> @@ -1,4 +1,6 @@
> # SPDX-License-Identifier: GPL-2.0-only
> +obj-$(CONFIG_QCOM_QMI_COOLING) += qmi_cooling/
> +
> obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o
>
> qcom_tsens-y += tsens.o tsens-v2.o tsens-v1.o tsens-v0_1.o \
> diff --git a/drivers/thermal/qcom/qmi_cooling/Kconfig b/drivers/thermal/qcom/qmi_cooling/Kconfig
> new file mode 100644
> index 000000000000..96488181cd5f
> --- /dev/null
> +++ b/drivers/thermal/qcom/qmi_cooling/Kconfig
> @@ -0,0 +1,14 @@
> +# SPDX-License-Identifier: GPL-2.0-only
> +
> +config QCOM_QMI_COOLING
> + tristate "Qualcomm QMI cooling drivers"
> + depends on QCOM_RPROC_COMMON
> + depends on ARCH_QCOM || COMPILE_TEST
> + select QCOM_QMI_HELPERS
> + help
> + This enables the remote subsystem cooling devices. These cooling
> + devices will be used by Qualcomm chipset to place various remote
> + subsystem mitigations like remote processor passive mitigation,
> + remote subsystem voltage restriction at low temperatures etc.
> + The QMI cooling device will interface with remote subsystem
> + using Qualcomm remoteproc interface.
> diff --git a/drivers/thermal/qcom/qmi_cooling/Makefile b/drivers/thermal/qcom/qmi_cooling/Makefile
> new file mode 100644
> index 000000000000..ea6cb3c8adb0
> --- /dev/null
> +++ b/drivers/thermal/qcom/qmi_cooling/Makefile
> @@ -0,0 +1,3 @@
> +# SPDX-License-Identifier: GPL-2.0-only
> +obj-$(CONFIG_QCOM_QMI_COOLING) += qcom_cooling.o
> +qcom_cooling-y += qcom_tmd_services.o qcom_qmi_cooling.o
> --
> 2.37.1
>