Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

From: Krzysztof Kozlowski
Date: Wed Nov 30 2022 - 10:08:51 EST

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On 29/11/2022 21:46, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
>
> Signed-off-by: Adam Skladowski <a39.skl@xxxxxxxxx>

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>

Best regards,
Krzysztof

Next message: Krzysztof Kozlowski: "Re: [PATCH 10/12] arm64: dts: qcom: sm6115: Add i2c/spi nodes"
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In reply to: Adam Skladowski: "[PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible"
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