RE: [PATCH v1 1/2] thermal: Add generic device cooling support

[Alice Guo (OSS)]

Hi,

I did not reply in time. Sorry to bother you. Please ignore this patchset.

Best Regards,
Alice Guo

> -----Original Message-----
> From: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx>
> Sent: Thursday, January 5, 2023 5:59 PM
> To: Alice Guo (OSS) <alice.guo@xxxxxxxxxxx>; rafael@xxxxxxxxxx;
> amitk@xxxxxxxxxx; rui.zhang@xxxxxxxxx; Aisheng Dong
> <aisheng.dong@xxxxxxx>; shawnguo@xxxxxxxxxx; Leo Li
> <leoyang.li@xxxxxxx>
> Cc: linux-arm-kernel@xxxxxxxxxxxxxxxxxxx; linux-pm@xxxxxxxxxxxxxxx;
> linux-kernel@xxxxxxxxxxxxxxx
> Subject: Re: [PATCH v1 1/2] thermal: Add generic device cooling support
> 
> On 05/01/2023 09:22, Alice Guo (OSS) wrote:
> > From: Anson Huang <Anson.Huang@xxxxxxx>
> >
> > To compatible with previous implementation, add generic device cooling
> > support, each thermal zone will register a cooling device, and when
> > temperature exceed passive trip, the device cooling driver will send
> > out a system wide notification, each device supporting cooling will
> > need to register device cooling and takes action when passive trip is
> > exceeded;
> 
> Can you explain the use case you want to solve with this solution and the
> limitations of the existing ones ?
> 
> 
> --
> <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs
> 
> Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
> <http://twitter.com/#!/linaroorg> Twitter |
> <http://www.linaro.org/linaro-blog/> Blog