Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure

[Rafael J. Wysocki]

Hi Daniel,

On Fri, Mar 3, 2023 at 10:24 AM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxx> wrote:
>
>
> Hi Rafael,
>
> Do we have enough ack to apply this series, is it for you ?

I've just queued it up for 6.4.

It will reach linux-next and the thermal branch some time next week,
but I will be traveling, so there may be delays.

Thanks!