Re: [PATCH v3 0/6] Thermal zone device structure encapsulation

From: Rafael J. Wysocki
Date: Tue Apr 18 2023 - 09:52:17 EST

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On Mon, Apr 17, 2023 at 3:17 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxx> wrote:
>
>
> Hi Rafael,
>
> I think I addressed your comments from V2.
>
> Is it fine if I merge this series in the thermal/bleeding-branch ?

This series is mostly Intel thermal material, so I'd prefer to take it
via thermal-intel when ready.

Thanks!

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