[PATCH v5 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909

[Stephan Gerhold]

Make the MDM9607 thermal sensor support consistent with Qualcomm's
vendor kernel (msm-3.18) by applying the correct default slope values
and adding "correction factors" to the factory calibration values in the
fuses. Use the same functionality to add the very similar MSM8909 SoC to
the tsens driver.

---
Changes in v5:
- Rebase on top of MSM8226 series that way applied by Daniel
  (https://lore.kernel.org/linux-arm-msm/4097223e-5297-1536-18bb-512ef28c8329@xxxxxxxxxx/)
- Add review tags from Dmitry
- Link to v4: https://lore.kernel.org/r/20230508-msm8909-tsens-v4-0-d9119622cb19@xxxxxxxxxxxxxxx
Changes in v4:
- Mostly just resend, explicitly initialize zero values for
  the MSM8909 p1/p2_calib_offset for better clarity (Konrad)
- Link to v3: https://lore.kernel.org/r/20230315103950.2679317-1-stephan.gerhold@xxxxxxxxxxxxxxx
Changes in v3:
- Drop now unused definition reported by kernel test robot
Changes in v2:
- Rewrite on top of per-sensor nvmem cell changes that landed in 6.3
- Add patches to fix existing support for MDM9607

---
Stephan Gerhold (6):
      thermal: qcom: tsens: Drop unused legacy structs
      thermal: qcom: tsens-v0_1: Fix mdm9607 slope values
      thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets
      dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
      dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
      thermal: qcom: tsens-v0_1: Add MSM8909 data

 .../devicetree/bindings/thermal/qcom-tsens.yaml    |  23 +----
 drivers/thermal/qcom/tsens-v0_1.c                  | 101 +++++++++++++--------
 drivers/thermal/qcom/tsens-v1.c                    |  22 -----
 drivers/thermal/qcom/tsens.c                       |  19 +++-
 drivers/thermal/qcom/tsens.h                       |   6 +-
 5 files changed, 88 insertions(+), 83 deletions(-)
---
base-commit: 7e25e9706bbade1b3dc670fad44a920d087064df
change-id: 20230508-msm8909-tsens-6733a6d415be

Best regards,
-- 
Stephan Gerhold
Kernkonzept GmbH at Dresden, Germany, HRB 31129, CEO Dr.-Ing. Michael Hohmuth