Re: [PATCH v1 1/5] dt-bindings: soc: qcom: Add memory_dump driver bindings

[Zhenhua Huang]

On 2023/10/23 20:52, Krzysztof Kozlowski wrote:
> On 23/10/2023 13:54, Zhenhua Huang wrote:
> > On 2023/10/23 17:27, Krzysztof Kozlowski wrote:
> > > On 23/10/2023 11:20, Zhenhua Huang wrote:
> > > > Add bindings for the QCOM Memory Dump driver providing debug
> > >
> > > Bindings are for hardware, not driver. This suggests it is not suitable
> > > for bindings at all.
> > >
> > > > facilities. Firmware dumps system cache, internal memory,
> > > > peripheral registers to reserved DDR as per the table which
> > > > populated by the driver, after crash and warm reset.
> > >
> > > Again driver :/
> >
> > Thanks for pointing out. Qualcomm memory dump device is a reserved
> > memory region which is used to communicate with firmware. I will update
> > description in next version.
>
> I have still doubts that it is suitable for DT. I usually expect  such
> firmware feature-drivers to be instantiated by existing firmware
> drivers. You do not need DT for this.

Got it, as it interacts with firmware, you think it should be a firmware 
driver? But it seems there should not be existing suitable place to put 
it now(qcom_scm.c is for TZ). Shall we create one new file like 
*qcom_sdi.c* in drivers/firmware and put it there? Because SDI(system 
debug image, which is part of bootloader) is the firmware doing the things.

> Best regards,
> Krzysztof