Re: clkdev: report over-sized strings when creating clkdev entries

From: Marek Szyprowski
Date: Thu May 16 2024 - 06:58:16 EST


On 16.05.2024 12:27, Naresh Kamboju wrote:
> On Wed, 15 May 2024 at 22:53, Russell King (Oracle)
> <linux@xxxxxxxxxxxxxxx> wrote:
>> On Tue, May 07, 2024 at 01:26:17PM -0700, Stephen Boyd wrote:
>>> Quoting Arnd Bergmann (2024-05-07 00:44:15)
>>>> On Tue, May 7, 2024, at 09:20, Naresh Kamboju wrote:
>>>>> The WinLink E850-96 board boot failed with Linux next-20240506 but there
>>>>> is no kernel crash log on the serial [1].
>>>>>
>>>>> Anders bisection results pointing to this commit,
>>>>> # first bad commit:
>>>>> [4d11c62ca8d77cb1f79054844b598e0f4e92dabe]
>>>>> clkdev: report over-sized strings when creating clkdev entrie
>>>>>
>>>>> After reverting the above patch the boot test passed [2].
>>>>>
>>>>> Reported-by: Linux Kernel Functional Testing <lkft@xxxxxxxxxx>
>>>>>
>>> There are two fixes on the list: [1] and [2]. Perhaps one of those
>>> resolves this?
>>>
>>> [1] https://lore.kernel.org/r/20240507065317.3214186-1-m.szyprowski@xxxxxxxxxxx
>> This one has (I think) ended up in the patch system last week, but it's
>> not clkdev, it's only related. I'm also not Cc'd on its posting, and
>> it's not posted to any mailing list that I'm a part of. So I've not
>> been following any discussion on it.
>>
>> Digging in to the discussion, I see various attributations, and a final
>> message reporting an unused variable, and a promise to send v2. So,
>> I'm guessing that
>> https://protect2.fireeye.com/v1/url?k=946226d9-f5e933ef-9463ad96-74fe485fffe0-28286a0026513387&q=1&e=a16c1c53-9c99-475a-b144-8adf7852ebc0&u=http%3A%2F%2Fwww.home.armlinux.org.uk%2Fdeveloper%2Fpatches%2Fviewpatch.php%3Fid%3D9397%2F1
> I do not have access to this link ^.
>
>> is now superseded in some way... I wouldn't have known without locating
>> this email and checking the links.


The fix for drivers/clk/samsung/clk.c driver has been merged to clk-next:

https://lore.kernel.org/all/f7a877622829db499bf2bc65fe9ffbff.sboyd@xxxxxxxxxx/

Best regards
--
Marek Szyprowski, PhD
Samsung R&D Institute Poland