From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
Make thermal_bind_cdev_to_trip() take a struct cooling_spec pointer
to reduce the number of its arguments, change the return type of
thermal_unbind_cdev_from_trip() to void and rearrange the code in
thermal_zone_cdev_binding() to reduce the indentation level.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
---
v2 -> v3: Subject fix
v1-> v2: No changes
---
drivers/thermal/thermal_core.c | 54 +++++++++++++++--------------------------
1 file changed, 21 insertions(+), 33 deletions(-)
Index: linux-pm/drivers/thermal/thermal_core.c
===================================================================
--- linux-pm.orig/drivers/thermal/thermal_core.c
+++ linux-pm/drivers/thermal/thermal_core.c
@@ -757,15 +757,7 @@ struct thermal_zone_device *thermal_zone
* @tz: pointer to struct thermal_zone_device
* @trip: trip point the cooling devices is associated with in this zone.
* @cdev: pointer to struct thermal_cooling_device
- * @upper: the Maximum cooling state for this trip point.
- * THERMAL_NO_LIMIT means no upper limit,
- * and the cooling device can be in max_state.
- * @lower: the Minimum cooling state can be used for this trip point.
- * THERMAL_NO_LIMIT means no lower limit,
- * and the cooling device can be in cooling state 0.
- * @weight: The weight of the cooling device to be bound to the
- * thermal zone. Use THERMAL_WEIGHT_DEFAULT for the
- * default value
+ * @c: cooling specification for @trip and @cdev