Re: [PATCH] dt-bindings: thermal: qcom-tsens: add SAR2130P compatible

From: Krzysztof Kozlowski
Date: Sun Oct 27 2024 - 17:07:36 EST

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On Sun, Oct 27, 2024 at 01:06:50AM +0300, Dmitry Baryshkov wrote:
> Document compatible for thermal sensors on Qualcomm SAR2130P platform.
>
> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx>

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>

Best regards,
Krzysztof

Next message: Krzysztof Kozlowski: "Re: [PATCH 1/3] dt-bindings: remoteproc: qcom,sm8350-pas: add SAR2130P aDSP compatible"
Previous message: Krzysztof Kozlowski: "Re: [PATCH 1/2] dt-bindings: arm: pmu: Add Samsung Mongoose core compatible"
In reply to: Dmitry Baryshkov: "[PATCH] dt-bindings: thermal: qcom-tsens: add SAR2130P compatible"
Next in thread: Daniel Lezcano: "Re: [PATCH] dt-bindings: thermal: qcom-tsens: add SAR2130P compatible"
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