Re: [PATCH RFC v2 1/5] dt-bindings: thermal: Add MBG thermal monitor support

From: Konrad Dybcio
Date: Fri Dec 13 2024 - 10:50:56 EST


On 12.12.2024 5:11 PM, Satya Priya Kakitapalli wrote:
> Add PM8775 ADC5 GEN3 Channel info and bindings for the MBG Temp
> alarm peripheral found on PM8775 pmic.
>
> Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@xxxxxxxxxxx>
> ---
> .../bindings/thermal/qcom-spmi-mbg-tm.yaml | 86 ++++++++++++++++++++++
> .../iio/adc/qcom,spmi-adc5-gen3-pm8775.h | 41 +++++++++++
> 2 files changed, 127 insertions(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-mbg-tm.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-mbg-tm.yaml
> new file mode 100644
> index 0000000000000000000000000000000000000000..909373eb758e4a8b7c2bbd0022c56ab2e823ca13
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-mbg-tm.yaml
> @@ -0,0 +1,86 @@
> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/qcom-spmi-mbg-tm.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Qualcomm Technologies, Inc. SPMI PMIC MBG Thermal Monitoring
> +
> +maintainers:
> + - Satya Priya Kakitapalli <quic_skakitap@xxxxxxxxxxx>
> +
> +description:
> + Qualcomm's MBG(Master Bandgap) temperature alarm monitors the die
> + temperature and generates an interrupt if the PMIC die temperature is
> + over a set of programmable temperature thresholds. It allows monitoring
> + for both hot and cold, LVL1 and LVL2 thresholds, which makes it different
> + from the existing temp alarm peripheral. The interrupt comes over SPMI
> + and the MBG's fault status register gives details to understand whether
> + it is a hot/cold and LVL1/LVL2 violation.
> +
> +allOf:
> + - $ref: thermal-sensor.yaml#
> +
> +properties:
> + compatible:
> + const: qcom,spmi-pm8775-mbg-tm

The bus the chip is connected over shouldn't be part of the compatible

Konrad