Re: [PATCH v3 0/2] mtd: spi-nor: winbond: Add support for flashes with several dies

[Pratyush Yadav]

On Fri, Jan 10 2025, Miquel Raynal wrote:

> Some Winbond devices are made of up smaller stacked dies, like for
> instance W25Q01JV which is a 1G-bit serial flash memory made of two
> 512M-bit dies, and W25Q02JV which is made of four of them. Internally,
> the dies can either be in the active state (only one at a time), the
> others being in the idle state. Problem: there are commands impacting
> all 4 dies, for which we monitor the state of the chip reading the
> status register, but the status register only gives the status of the
> active die. It was observed a possible internal deviation of up to 200us
> between each die when doing similar operations, which can lead to
> races. This series aims at supporting these chips properly.

Applied to spi-nor/next. Thanks!

-- 
Regards,
Pratyush Yadav