Re: [PATCH v2 14/29] ASoC: tas2770: expose die temp to hwmon

From: Mark Brown
Date: Tue Feb 18 2025 - 10:25:13 EST


On Tue, Feb 18, 2025 at 06:35:48PM +1000, James Calligeros wrote:
> Create and register a hwmon device to export the die temperature
> to the hwmon interface

Oh, so there is actualy a hwmon device added (which was why I thought
you were ignoring my review comments on the last patch...). The
question then becomes why also have the custom ABI for this as well?

sysfs files are also supposed to be documented in Documention/ABI,
though actal enforcement of that is a bit patchy.

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