Re: [PATCH 03/10] dt-bindings: vendor-prefixes: add eswin

From: Conor Dooley
Date: Tue Mar 11 2025 - 14:15:28 EST


On Tue, Mar 11, 2025 at 01:04:25PM +0530, Pinkesh Vaghela wrote:
> From: Pritesh Patel <pritesh.patel@xxxxxxxxxxxxxx>
>
> Add new vendor string to dt bindings.
> This new vendor string is used by
> - ESWIN EIC770X SoC
> - HiFive Premier P550 board which uses EIC7700 SoC.
>
> Link: https://www.eswin.com/en/
> Signed-off-by: Pritesh Patel <pritesh.patel@xxxxxxxxxxxxxx>
> Reviewed-by: Samuel Holland <samuel.holland@xxxxxxxxxx>
> Signed-off-by: Pinkesh Vaghela <pinkesh.vaghela@xxxxxxxxxxxxxx>

Acked-by: Conor Dooley <conor.dooley@xxxxxxxxxxxxx>

> ---
> Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++
> 1 file changed, 2 insertions(+)
>
> diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
> index 5079ca6ce1d1..07ff140e67dc 100644
> --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
> +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
> @@ -490,6 +490,8 @@ patternProperties:
> description: Espressif Systems Co. Ltd.
> "^est,.*":
> description: ESTeem Wireless Modems
> + "^eswin,.*":
> + description: Beijing ESWIN Technology Group Co. Ltd.
> "^ettus,.*":
> description: NI Ettus Research
> "^eukrea,.*":
> --
> 2.25.1
>

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