[PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
From: Gaurav Kohli
Date: Tue Dec 23 2025 - 07:33:46 EST
The cooling subnode of a remoteproc represents a client of the Thermal
Mitigation Device QMI service running on it. Each subnode of the cooling
node represents a single control exposed by the service.
Add maintainer name also and update this binding for cdsp substem.
Co-developed-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
Signed-off-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
---
.../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
.../bindings/thermal/qcom,qmi-cooling.yaml | 99 +++++++++++++++++++
2 files changed, 105 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
index 63a82e7a8bf8..bbc82253f76b 100644
--- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
+++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
@@ -77,6 +77,12 @@ properties:
and devices related to the ADSP.
unevaluatedProperties: false
+ cooling:
+ $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
+ description:
+ Cooling subnode which represents the cooling devices exposed by the Modem.
+ unevaluatedProperties: false
+
required:
- clocks
- clock-names
diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
new file mode 100644
index 000000000000..90b46712d241
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
@@ -0,0 +1,99 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+# Copyright 2023 (c), Linaro Limited
+
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
+
+maintainers:
+ - Caleb Connolly <caleb.connolly@xxxxxxxxxx>
+ - Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
+
+description:
+ Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
+ across multiple remote subsystems. These devices operate based on junction temperature
+ sensors (TSENS) associated with thermal zones for each subsystem.
+
+ Each subnode corresponds to a control interface for a single instance of the TMD
+ service running on a remote subsystem.
+
+definitions:
+ tmd:
+ type: object
+ description: |
+ A single Thermal Mitigation Device exposed by a remote subsystem.
+ properties:
+ label:
+ maxItems: 1
+ "#cooling-cells":
+ $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
+ phandle: true
+
+ required:
+ - label
+ - "#cooling-cells"
+
+ additionalProperties: false
+
+properties:
+ compatible:
+ enum:
+ - qcom,qmi-cooling-modem
+ - qcom,qmi-cooling-cdsp
+
+ vdd:
+ $ref: "#/definitions/tmd"
+ description:
+ Modem processor temperature TMD
+ properties:
+ label:
+ const: modem
+
+required:
+ - compatible
+
+allOf:
+ - if:
+ properties:
+ compatible:
+ contains:
+ const: qcom,qmi-cooling-cdsp
+ then:
+ properties:
+ cdsp_sw:
+ $ref: "#/definitions/tmd"
+ description:
+ CDSP software TMD
+ properties:
+ label:
+ const: cdsp_sw
+
+unevaluatedProperties: false
+
+examples:
+ - |
+ remoteproc-cdsp {
+ cooling {
+ compatible = "qcom,qmi-cooling-cdsp";
+
+ cdsp_sw0: cdsp_sw {
+ label = "cdsp_sw";
+ #cooling-cells = <2>;
+ };
+ };
+ };
+
+ remoteproc-cdsp1 {
+ cooling {
+ compatible = "qcom,qmi-cooling-cdsp1";
+
+ cdsp_sw1: cdsp_sw {
+ label = "cdsp_sw";
+ #cooling-cells = <2>;
+ };
+ };
+ };
+...
--
2.34.1