Re: [PATCH v1 4/8] thermal: qcom: add qmi-cooling driver

[Dmitry Baryshkov]

On 31/12/2025 08:28, Gaurav Kohli wrote:
> On 12/24/2025 1:19 AM, Dmitry Baryshkov wrote:
> > On Tue, Dec 23, 2025 at 06:02:23PM +0530, Gaurav Kohli wrote:
> > > From: Casey Connolly <casey.connolly@xxxxxxxxxx>
> > >
> > > The Thermal Mitigation Device (TMD) service exposes various platform
> > > specific thermal mitigations available on remote subsystems (ie the
> > > modem and cdsp). The service is exposed via the QMI messaging
> > > interface, usually over the QRTR transport.
> > >
> > > Qualcomm QMI-based TMD cooling devices are used to mitigate thermal
> > > conditions across multiple remote subsystems. These devices operate
> > > based on junction temperature sensors (TSENS) associated with thermal
> > > zones for each subsystem.
> > >
> > > Co-developed-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > > Signed-off-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
> > > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > > ---
> > >   drivers/soc/qcom/Kconfig           |  13 +
> > >   drivers/soc/qcom/Makefile          |   1 +
> > >   drivers/soc/qcom/qmi-cooling.c     | 498 +++++++++++++++++++++++++++++
> > >   drivers/soc/qcom/qmi-cooling.h     | 428 +++++++++++++++++++++++++
> > >   drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++++++++++
> > >   5 files changed, 1368 insertions(+)
> > >   create mode 100644 drivers/soc/qcom/qmi-cooling.c
> > >   create mode 100644 drivers/soc/qcom/qmi-cooling.h
> > >   create mode 100644 drivers/thermal/qcom/qmi-cooling.h
> > >
> > > diff --git a/drivers/soc/qcom/Kconfig b/drivers/soc/qcom/Kconfig
> > > index 2caadbbcf830..905a24b42fe6 100644
> > > --- a/drivers/soc/qcom/Kconfig
> > > +++ b/drivers/soc/qcom/Kconfig
> > > @@ -124,6 +124,19 @@ config QCOM_PMIC_GLINK
> > >         Say yes here to support USB-C and battery status on modern 
> > > Qualcomm
> > >         platforms.
> > > +config QCOM_QMI_COOLING
> > > +    tristate "Qualcomm QMI cooling drivers"
> > > +    depends on QCOM_RPROC_COMMON
> > > +    depends on ARCH_QCOM || COMPILE_TEST
> > > +    select QCOM_QMI_HELPERS
> > > +    help
> > > +       This enables the remote subsystem cooling devices. These cooling
> > > +       devices will be used by Qualcomm chipset to place various remote
> > > +       subsystem mitigations like remote processor passive mitigation,
> > > +       remote subsystem voltage restriction at low temperatures etc.
> > > +       The QMI cooling device will interface with remote subsystem
> > > +       using Qualcomm remoteproc interface.
> > > +
> > >   config QCOM_QMI_HELPERS
> > >       tristate
> > >       depends on NET
> > > diff --git a/drivers/soc/qcom/Makefile b/drivers/soc/qcom/Makefile
> > > index b7f1d2a57367..b6728f54944b 100644
> > > --- a/drivers/soc/qcom/Makefile
> > > +++ b/drivers/soc/qcom/Makefile
> > > @@ -14,6 +14,7 @@ obj-$(CONFIG_QCOM_PMIC_GLINK)    += pmic_glink.o
> > >   obj-$(CONFIG_QCOM_PMIC_GLINK)    += pmic_glink_altmode.o
> > >   obj-$(CONFIG_QCOM_PMIC_PDCHARGER_ULOG)    += pmic_pdcharger_ulog.o
> > >   CFLAGS_pmic_pdcharger_ulog.o    :=  -I$(src)
> > > +obj-$(CONFIG_QCOM_QMI_COOLING) += qmi-cooling.o
> > >   obj-$(CONFIG_QCOM_QMI_HELPERS)    += qmi_helpers.o
> > >   qmi_helpers-y    += qmi_encdec.o qmi_interface.o
> > >   obj-$(CONFIG_QCOM_RAMP_CTRL)    += ramp_controller.o
> > > diff --git a/drivers/soc/qcom/qmi-cooling.c b/drivers/soc/qcom/qmi- 
> > > cooling.c
> > > new file mode 100644
> > > index 000000000000..1a6afcb96bf6
> > > --- /dev/null
> > > +++ b/drivers/soc/qcom/qmi-cooling.c
> > > @@ -0,0 +1,498 @@
> > > +// SPDX-License-Identifier: GPL-2.0
> > > +/*
> > > + * Copyright (c) 2017, The Linux Foundation
> > > + * Copyright (c) 2025, Linaro Limited
> > > + *
> > > + * QMI Thermal Mitigation Device (TMD) client driver.
> > > + * This driver provides an in-kernel client to handle hot and cold 
> > > thermal
> > > + * mitigations for remote subsystems (modem and DSPs) running the 
> > > TMD service.
> > > + * It doesn't implement any handling of reports from remote subsystems.
> > > + */
> > > +
> > > +#include <linux/cleanup.h>
> > > +#include <linux/err.h>
> > > +#include <linux/module.h>
> > > +#include <linux/net.h>
> > > +#include <linux/of.h>
> > > +#include <linux/platform_device.h>
> > > +#include <linux/remoteproc/qcom_rproc.h>
> > > +#include <linux/remoteproc_cooling.h>
> > > +#include <linux/slab.h>
> > > +#include <linux/soc/qcom/qmi.h>
> > > +#include <linux/thermal.h>
> > > +
> > > +#include "qmi-cooling.h"
> > > +
> > > +#define MODEM0_INSTANCE_ID    0x0
> > > +#define ADSP_INSTANCE_ID    0x1
> > > +#define CDSP_INSTANCE_ID    0x43
> > Will CDSP1 also use instance ID? What are instance IDs for GPDSP?
>
>
> In Leman's there are two different cdsp subsytem, i will add new 
> instance id for that also.
>
> What is GPdsp, you mean gpu ?

No, I mean general purpose DSP aka GPDSP aka GDSP.

--
With best wishes
Dmitry