Re: [PATCH v1 0/8] Add RemoteProc cooling support
From: Gaurav Kohli
Date: Mon Feb 09 2026 - 05:24:22 EST
On 2/2/2026 3:23 PM, Konrad Dybcio wrote:
On 2/1/26 9:20 PM, Trilok Soni wrote:
On 1/13/2026 1:33 AM, Gaurav Kohli wrote:
On 1/10/2026 9:43 PM, Casey Connolly wrote:
Hi Casey,
On 12/23/25 13:32, Gaurav Kohli wrote:
This series introduces a generic remote proc cooling framework to control
thermal sensors located on remote subsystem like modem, dsp etc.
Communications with these subsystems occurs through various channels, for example,
QMI interface for Qualcomm.
The Framework provides an abstraction layer between thermal subsytem and vendor
specific remote subsystem. Vendor drivers are expected to implement callback
and registration mechanisms with cooling framework to control cooling
devices.
This patchset also revives earlier discussions of QMI based TMD cooling
devices discussion posted on below series by Casey:
https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@xxxxxxxxxx/
That series introduced Qualcomm QMI-based TMD cooling devices which used
to mitigate thermal conditions across multiple remote subsystems. These
devices operate based on junction temperature sensors (TSENS) associated
with thermal zones for each subsystem and registering with remoteproc
cooling framework for cooling registration.
This patch series has a compilation/runtime dependency on another series [1].
[1] https://lore.kernel.org/linux-devicetree/20250822042316.1762153-1-quic_gkohli@xxxxxxxxxxx/
Casey Connolly (2):
remoteproc: qcom: probe all child devices
thermal: qcom: add qmi-cooling driver
I'm glad this series is getting revived. It would be good if you could explain what changes you made to my patches somewhere.
I also remember one of my patches adding the DT parts for SDM845, would you be willing to pick that up for the next revision? I'd be happy to provide my Tested-by.
Kind regards,
With this remoeproc cooling abstraction layer, we have integrated your patches for subsystem cooling. As lot of comments came for qmi-cooling driver, so need to send v2 with cleanup.
Gaurav - the question somewhere in the series was that why you had marked your patch series
to v1, when you had revived the original (v1?) series from Casey? Should we consider
current patch series as v2 then? I don't know if that comment was concluded.
Because we have effectively 2 'v1's, there's already a certain mess, but
the msgid is different between them so the tools won't be confused
(i.e. just go with v2 for the next revision)
The outstanding request is to include a high-level changelog of what is
different as compared to the original series (as well as picking up the
original 845 DT commit if still relevant)
thanks, sure will update changelog for the actual diff/design change in next version.
Konrad