[PATCH] dt-bindings: thermal: qcom-tsens: Document the maili Temperature Sensor
From: Haritha S K via B4 Relay
Date: Wed Jun 17 2026 - 00:34:45 EST
From: Haritha S K <haritha.k@xxxxxxxxxxxxxxxx>
Document the Temperature Sensor (TSENS) on the Qualcomm maili SoC.
Signed-off-by: Haritha S K <haritha.k@xxxxxxxxxxxxxxxx>
---
Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
1 file changed, 1 insertion(+)
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index f0efaa8349ee..5a8f7673e730 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -58,6 +58,7 @@ properties:
- qcom,glymur-tsens
- qcom,hawi-tsens
- qcom,kaanapali-tsens
+ - qcom,maili-tsens
- qcom,milos-tsens
- qcom,nord-tsens
- qcom,msm8953-tsens
---
base-commit: a76326dca329a7a738ba367529868dfbafb4a403
change-id: 20260616-b4-maili-upstream-3-b198aaa8969f
Best regards,
--
Haritha S K <haritha.k@xxxxxxxxxxxxxxxx>