Re: [PATCH linux-next] thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
From: Daniel Lezcano
Date: Fri Aug 21 2026 - 07:19:12 EST
Le 21/08/2026 à 12:29, Uwe Kleine-König a écrit :
Hello,Rafael ? Do you want to pick it up directly in linux-pm/thermal ?
On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
I did plan for this being a possible issue:
Ideal is merge
https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
to the thermal tree. If I'd called that out originally (or a thermal
rebase is a possibility) it would be cleaner to do this before the
qcom patch adds another user then squash what you have here in the appropriate
patch. Alternative is do it as a merge conflict resolution whilst merging
in that tree. If the second, I'd also mention that in the thermal pull request to
Linus given it's a little unusual.
Ah, I did not realize that you had a stable branch with the module
namespace patch. Merging that in then applying this to the thermal tree
seems like the best course of action. If rebasing is possible, I do not
mind this patch being squashed into the original.
FTR, this issue is still present as of next-20260820. Assuming that
c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
thermal monitoring") is supposed to go into v7.3-rc1, it would be
awesome to address this before the commit hits Linus' tree.