Re: [PATCH linux-next] thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER

[Rafael J. Wysocki (Intel)]

On Fri, Aug 21, 2026 at 12:40 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxxxxxxxx> wrote:
>
> Le 21/08/2026 à 12:29, Uwe Kleine-König a écrit :
> > Hello,
> >
> > On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
> >> On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
> >>> I did plan for this being a possible issue:
> >>>
> >>> Ideal is merge
> >>> https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
> >>> to the thermal tree.  If I'd called that out originally (or a thermal
> >>> rebase is a possibility) it would be cleaner to do this before the
> >>> qcom patch adds another user then squash what you have here in the appropriate
> >>> patch.  Alternative is do it as a merge conflict resolution whilst merging
> >>> in that tree.  If the second, I'd also mention that in the thermal pull request to
> >>> Linus given it's a little unusual.
> >>
> >> Ah, I did not realize that you had a stable branch with the module
> >> namespace patch. Merging that in then applying this to the thermal tree
> >> seems like the best course of action. If rebasing is possible, I do not
> >> mind this patch being squashed into the original.
> >
> > FTR, this issue is still present as of next-20260820. Assuming that
> > c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
> > thermal monitoring") is supposed to go into v7.3-rc1, it would be
> > awesome to address this before the commit hits Linus' tree.
> Rafael ? Do you want to pick it up directly in linux-pm/thermal ?

Yes, I will apply it directly, thanks!