Re: [PATCH 2/2] arm64: dts: qcom: sm6125: add TSENS and thermal zones

[Abel Vesa]

On 26-08-21 06:03:25, Roman Linev wrote:
> SM6125 has a TSENS v2 controller with 16 sensors, at 0x04411000 (TM) and
> 0x04410000 (SROT), with SPI 275 as "uplow" and SPI 190 as "critical".
> The register and interrupt layout is identical to SM6115's, and being v2
> the block self-calibrates, so it needs no qfprom nvmem cells and no new
> driver code: it binds through the existing qcom,tsens-v2 fallback.
> 
> Add the controller and thermal zones for the 15 sensors that are used.
> The sensor-to-zone mapping comes from the downstream device tree for
> Xiaomi Mi A3 (laurel_sprout), cross-checked against mainline sm6115.dtsi,
> which agrees on sensors 2, 3, 4, 13, 14 and 15. Sensor 5 is not
> referenced downstream and is left out.
> 
> No cooling devices are wired up: SM6125 has no GPU node upstream yet, so
> there is nothing to reference. The zones report temperature and carry
> passive and critical trips; cooling maps can be added alongside the
> consumers when those land.
> 
> Tested on Xiaomi Mi A3 (sm6125): tsens0 binds at 4411000.thermal-sensor
> with no dmesg output, the thermal zone count goes from 5 to 20, and the
> 15 new die zones read 37.7-39.6 degrees Celsius at idle. Under a 660 s
> glmark2-es2-drm soak the hottest zone reached 52.2 degrees Celsius, well
> below its 85 degrees Celsius passive trip.
> 
> Both SM6125 boards still build with no new dtc warnings.
> 
> Signed-off-by: Roman Linev <admin@xxxxxxxx>

Reviewed-by: Abel Vesa <abel.vesa@xxxxxxxxxxxxxxxx>