Re: [PATCH v2 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens

[Krzysztof Kozlowski]

On Sat, Oct 31, 2026 at 06:52:49PM +0530, Gaurav Kohli wrote:
> From: Amit Kucheria <amit.kucheria@xxxxxxxxxxxxxxxx>
> 
> QCM6490 uses a tsens-v2 IP block and supports hardware-binned critical
> trip points. Add its compatible to the tsens-v2 enum.
> 
> SoCs that support hardware-bin critical trips read their manufacturing
> bin from qfprom fuse cells rather than the usual calibration cells: a
> single "i-temp" bit on hamoa/purwa-class parts, and a "jtag-id"/
> "feat-id" pair on sc7280/qcm6490. Extend nvmem-cell-names with two
> oneOf branches so these fuse-cell names validate.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@xxxxxxxxxxxxxxxx>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 8 ++++++++
>  1 file changed, 8 insertions(+)

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxxxxxxxx>

Best regards,
Krzysztof